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LORD® 975-1052 encapsulant is a two-component epoxy system designed specifically for encapsulating electronic components used in remote sensors and sensing devices. It provides a semi-rigid epoxy system for applications where thermal shock is expected.
Thermoset 300/18 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/65 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/67 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/70 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/72 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures and applications where high thermal shock is expected. It provides a semi-rigid epoxy system.
Thermoset DC-812 epoxy encapsulant is a two-component system designed specifically for potting high voltage, automotive ignition coils.
Chemlok® EP5081-40 fluorescing additive is designed for use with the clear Chemlok adhesives. It is used to readily identify adhesive coverage on the material surface when exposed to an ultraviolet (UV) light source.
LORD® LokRelease™ 100 mold release is a fast curing release agent designed for use with molded elastomers. It provides a semi-permanent, anti-stick surface coating for fast, easy part removal from molds.
LORD® LokRelease™ 100EZ mold release is a fast curing, nontransferable release agent designed for use with molded elastomers. It provides a semi-permanent, anti-stick surface coating for fast, easy part removal from molds.
LORD® LokRelease™ 200 Release Agent is designed for use with molded elastomers. This water-based release agent provides a non-transferable, non-interfering non-stick coating for quick and easy removal of parts from molds.