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PRODUCT SERIES
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Fusor® 123SL sealer is a two-component, urethane-based seam sealer used for duplicating factory appearance on truck bed, tooled door skin, floor pan and core support seams.
Fusor® 127EZ adhesive is a two-component, urethane-based adhesive used for bonding plastic body panels, spoilers and ground effects.
Fusor® 129 controlled flow sealer is a two-component, epoxy-based seam sealer used for duplicating factory appearance on roof channels, door seams, drip rails, trunk seams and truck bed floor seams.
Fusor® 130 rigid foam is a two-component, urethane-based foam used for sound & vibration dampening, reinforcement, and sealing/filling of fender rails, pillars, rocker panels, quarter panels and floors.
Fusor® 132/133 adhesive is a two-component, urethane-based adhesive used for structural and cosmetic repair of bumpers, bumper tabs, and other interior and exterior plastic components.
Fusor® 141/140 adhesive is a two-component, urethane-based adhesive used for structural repair of bumper tabs, headlamps and other interior and exterior plastic components.
Fusor® 142/143 adhesive is a two-component, urethane-based adhesive used for structural and cosmetic repair of bumpers, bumper tabs, and other interior and exterior plastic components.
Fusor® 147 adhesive is a two-component, urethane-based adhesive used for installation and bonding of small body panels, ground effects and headlight buckets.
Fusor® 152 adhesive is a two-component, urethane-based adhesive used for structural and cosmetic repair of bumpers, bumper tabs, and other interior and exterior plastic components.
Fusor® 208B adhesive is a two-component, epoxy-based panel bonding adhesive offering low odor during application and tack-free when cured.
Fusor® 2098 adhesive is a two-component, epoxy-based, structural metal bonding adhesive providing the strength and durability of OEM quality repairs.
Fusor® 2200/2201 sealer/adhesive is a black, two-component urethane adhesive system used to bond FRP, SMC and other plastics with little surface preparation where bond strengths greater than the substrate are desired.