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电子灌封和封装产品系列

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73 个系列
Circalok 6055 Epoxy Encapsulant

Circalok 6055 Epoxy Encapsulant

Circalok 6055 encapsulant is a two-component epoxy encapsulating system designed for encapsulating and casting applications where non-burning properties are required.

动态粘度12000 cP @ 77°F (25°C) (resin), 600 cP @ 77°F (25°C), 4000 cP @ 77°F (25°C) (mixed) Hardness77 Shore D Cure Time24 Hours @ 77°F (25°C), 2 Hours @ 140°F (60°C)
Circalok 6250 Hardener

Circalok 6250 Hardener

Circalok 6250 hardener is a curing agent designed for use with various Circalok epoxy resins to obtain high solids formulations useful in adhesive, electrical encapsulation and laminate applications.

动态粘度350 cP @ 77°F (25°C) 颜色Amber Liquid
Circalok 6403 A BLK / B Urethane Encapsulant

Circalok 6403 A BLK / B Urethane Encapsulant

Circalok 6403 A BLK/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A BLK/B urethane encapsulant does not contain MOCA or TDI.

动态粘度750 cP @ 81°F (27°C) (resin), 1200 cP @ 81°F (27°C) (hardener), 900 cP @ 81°F (27°C) (mixed) Hardness80 Shore A Cure Time30 to 45 min @ 77°F (25°C), 5 to 10 min @ 212°F (100°C)
Circalok 6403 A SLW / B Urethane Encapsulant

Circalok 6403 A SLW / B Urethane Encapsulant

Circalok 6403 A SLW/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A SLW/B urethane encapsulant does not contain MOCA or TDI.

动态粘度750 cP @ 81°F (27°C) (resin), 1200 cP @ 81°F (27°C) (hardener), 900 cP @ 81°F (27°C) (mixed) Hardness80 Shore A Cure Time30 to 45 min @ 77°F (25°C), 5 to 10 min @ 212°F (100°C)
Circalok 6408 A SLW/B Urethane Encapsulant

Circalok 6408 A SLW/B Urethane Encapsulant

Circalok 6408 A SLW/B urethane encapsulant is a solvent-free, two-component system designed to provide a shock-resistant sealant for encapsulating and potting applications.

动态粘度5500 cP @ 77°F (25°C) (resin), 100 cP @ 77°F (25°C) (hardener), 5000 cP @ 77°F (25°C) (mixed) Hardness85 Shore A Cure Time24 Hours @ 77°F (25°C)
Circalok 6410 A/B Urethane Encapsulant

Circalok 6410 A/B Urethane Encapsulant

Circalok 6410 A/B urethane encapsulant is a two-component system formulated for tooling mechanical goods and model making. Circalok 6410 encapsulant is an easy handling casting elastomer designed for room temperature mixing, pouring and curing.

动态粘度1250 cP @ 77°F (25°C) (resin), 95 cP @ 77°F (25°C) (hardener), 600 cP @ 77°F (25°C) (mixed) Hardness55 Shore 00 Cure Time4 Hours @ 77°F (25°C), 1 Hours @ 149°F (65°C)
Circalok 6716/6733 Silicone System

Circalok 6716/6733 Silicone System

Circalok 6716/6733 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating both low- and high-voltage electrical and electronic assemblies.

动态粘度10000 cP @ 77°F (25°C) (resin) Hardness45 Shore A Cure Time12 to 16 Hours @ 77°F (25°C)
Circalok 6735 Silicone Encapsulant

Circalok 6735 Silicone Encapsulant

Circalok 6735 encapsulant is a two-component, addition-cure silicone system for applications where high temperature service and flexible system are required. It adheres to most substrates without the use of a primer.

动态粘度3700 cP @ 77°F (25°C) (resin), 200 cP @ 77°F (25°C) (hardener), 3500 cP @ 77°F (25°C) (mixed) Hardness40 Shore A Cure Time4 Hours @ 149°F (65°C)
Circalok 6744 Silicone Encapsulant

Circalok 6744 Silicone Encapsulant

Circalok 6744 encapsulant is a two-component silicone system for use in applications requiring a low viscosity, flame retardant encapsulating material.

动态粘度3000 cP @ 77°F (25°C) (resin), 2500 cP @ 77°F (25°C) (hardener), 2700 cP @ 77°F (25°C) (mixed) Hardness55 Shore A Cure Time45 min @ 149°F (65°C), 2 Hours @ 77°F (25°C)
LORD® 600/18 Epoxy System

LORD® 600/18 Epoxy System

LORD® 600/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度13500 cP @ 77°F (25°C) (resin), 50 cP @ 77°F (25°C) (hardener) Hardness88 Shore D Cure Time24 Hours @ 77°F (25°C)
LORD® 600/25 Epoxy System

LORD® 600/25 Epoxy System

LORD® 600/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度13500 cP @ 77°F (25°C) (resin) Hardness80 Shore D Cure Time24 Hours @ 77°F (25°C)
LORD® 600/37 Epoxy System

LORD® 600/37 Epoxy System

LORD® 600/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

动态粘度13500 cP @ 77°F (25°C) (resin), 40000 cP @ 77°F (25°C) (hardener) Hardness84 Shore D Cure Time24 Hours @ 77°F (25°C), 2 Hours @ 151°F (66°C), 0.05 Hours @ 199°F (93°C)