# CHO-BOND 1038 单组分导电硅胶密封剂

> 派克固美丽的 CHO BOND® 1038 是一种单组分镀银铜填充密封剂，配制好后用作 填缝剂，以提供 EMI 屏蔽保护或进行电气接地

所属技术：密封技术

## 技术参数

| 参数 | 值 | 单位 |
| --- | --- | --- |
| 聚合材料选件 | 硅橡胶 |  |
| 填充材料 | 铜镀银 |  |
| 比率 | 1-部分 |  |
| 颜色 | 灰色 |  |
| 体积电阻率 | 0.01 Ω-cm |  |
| 搭接剪切强度 | 1034 kPa |  |
| 比重 | 3.6 |  |
| 硬度计 | 80 |  |
| 工作温度 | '-55到125 °C |  |
| 运行时间 | 0.5 小时 Hours |  |
| 保质期 | 6 Months |  |
| 薄膜厚度 | 0.18-3.18 mm |  |

## 型号入口（首批）

- [50-02-1038-0000](https://hypher.com.cn/products/model/50-02-1038-0000-323d36e7b70cb596/index.md)
- [50-02-1038-1000](https://hypher.com.cn/products/model/50-02-1038-1000-a4c7991193610e96/index.md)
- [50-33-1038-0000](https://hypher.com.cn/products/model/50-33-1038-0000-6c992fae9889c7ec/index.md)
- [50-01-1038-0000](https://hypher.com.cn/products/model/50-01-1038-0000-0bb97f3b45272982/index.md)
- [50-31-1038-0000](https://hypher.com.cn/products/model/50-31-1038-0000-a9fb0721ade88202/index.md)

## 技术资料与 CAD

- [Application Note: Conductive Silicone Adhesive / Sealant Application Procedure](https://hypher.com.cn/library-assets/9900c328cbcfeaebfa1c7abec6d405ef01e7c11ab683df748b8361a0faffc6aa.pdf)：document
- [Brochure: EMI/EMC and Product Safety Compliance Testing Services](https://www.parker.com/content/dam/Parker-com/Literature/Chomerics/Parker-Chomerics-Test-Services-Brochure.pdf)：document
- [Datasheet: CHO-BOND® 1038 and 1121](https://hypher.com.cn/library-assets/8f32d5553d4d702ebf20c590dc8a01b01258e415fdaf15766df78cb0ae8a8e80.pdf)：document
- [Find Your Local Parker Chomerics Sales Rep or Distributor](https://hypher.com.cn/library-assets/3aa582471651675dc1006f5aaab64fef7c13382081115f985b1936ba2623cb60.pdf)：document
- [Parker Chomerics Safety Data Sheets (SDS)](http://web.chempliance.com/PublicAccess.aspx?t=5uGMHJCa1MleH2lkHnFu2g2)：document
- [Parker Chomerics Shelf Life Re-certification for EMI Shielding Paints, Sealants and Adhesives](https://hypher.com.cn/library-assets/1beb166d46b7f0cd6a3d48161d30da0fea317ac5c041939ae96b057d2adb5730.pdf)：document
- [Product Compliance: REACH SVHC Meets Requirements](https://hypher.com.cn/library-assets/11c283ca609c61dbe85aa917de9df63f3816a38f563e1926251e2d051b758bc0.pdf)：document
- [Recommended Surface Preparation for Epoxies, Acrylics and Silicones](https://hypher.com.cn/library-assets/2360693e66100e36470ad93c3bcb4a784b3a39d574eb6ae23b2e0b0dbfd40125.pdf)：document
- [Safety Data Sheet (SDS): CHO-BOND 1038](http://qrcode.chempliance.com/OpenDoc.ashx?DocID=db403ec8-088e-ea11-92dd-782bcb34946a)：document
- [Selector Guide: Parker Chomerics Specialty Materials](https://hypher.com.cn/library-assets/5e5c947e792a0d02c27292e944050e145492c97c53479dde6edf4c49a8d6c485.pdf)：document
- [parker%20chomerics%20cho-bond%201038.pdf](http://www.parker.com/Literature/Chomerics/Parker%20Chomerics%20CHO-BOND%201038.pdf)：document

资料来源：[原始系列资料](https://ph.parker.com/cn/zh/product-list/cho-bond-1038-one-component-electrically-conductive-silicone-sealant)

价格、库存和交期请联系上海海费确认。更多型号和资料见 [完整系列页面](https://hypher.com.cn/products/sealing/cho-bond-1038-one-component-electrically-conductive-silicone-sealant)；[联系技术支持](https://hypher.com.cn/contact)