# CHO-BOND 584-29双组分环氧树脂银填充导电粘合剂

> 派克固美丽的 CHO-BOND® 584-29 导电粘合剂是一种双组分银填充环氧树脂粘合剂，可配制组合用于薄粘合层和要求精确应用的情况

所属技术：密封技术

## 技术参数

| 参数 | 值 | 单位 |
| --- | --- | --- |
| 重量 | 1, 2.5, 10 x 3, 10, 85, 454 g, 2.5 g, 10 x 3 g, 10 g, 85 g, 454 g |  |
| 包括底漆 | 无需求 |  |
| 聚合材料选件 | 环氧树脂 |  |
| 填充材料 | 银 |  |
| 比率 | 100:6.3 |  |
| 颜色 | 银 |  |
| 体积电阻率 | 0.002 Ω-cm |  |
| 搭接剪切强度 | 8274 kPa |  |
| 比重 | 2.5 |  |
| 硬度计 | 80 |  |
| 工作温度 | '-55 到 125 °C |  |
| 运行时间 | 半小时 Hours |  |
| 保质期 | 12 Months |  |
| 薄膜厚度 | 0.03 mm |  |

## 型号入口（首批）

- [50-10-0584-0029](https://hypher.com.cn/products/model/50-10-0584-0029-96644ec4b408bb6b/index.md)
- [50-02-0584-0029](https://hypher.com.cn/products/model/50-02-0584-0029-3cc9ba3c373256c5/index.md)
- [50-30-0584-0029](https://hypher.com.cn/products/model/50-30-0584-0029-76f7e215b5b78917/index.md)
- [50-03-0584-0029](https://hypher.com.cn/products/model/50-03-0584-0029-bc903a511eecb187/index.md)
- [50-00-0584-0029](https://hypher.com.cn/products/model/50-00-0584-0029-d296bcf01317f85e/index.md)
- [50-01-0584-0029](https://hypher.com.cn/products/model/50-01-0584-0029-d742e6f6d3bd06be/index.md)

## 技术资料与 CAD

- [Brochure: EMI/EMC and Product Safety Compliance Testing Services](https://www.parker.com/content/dam/Parker-com/Literature/Chomerics/Parker-Chomerics-Test-Services-Brochure.pdf)：document
- [Datasheet: CHO-BOND 584-29 Syringe Kit](https://hypher.com.cn/library-assets/582327cc71ade36671ef9ec8a6ae4328de933651cae6321ce88684ef79d46ba5.pdf)：document
- [Datasheet: CHO-BOND® 584-29](https://hypher.com.cn/library-assets/8521a0a8c1802455471ad48a0cc2ec5500f798ff0050664b80b0cf393ac7f1a4.pdf)：document
- [Find Your Local Parker Chomerics Sales Rep or Distributor](https://hypher.com.cn/library-assets/3aa582471651675dc1006f5aaab64fef7c13382081115f985b1936ba2623cb60.pdf)：document
- [Parker Chomerics Safety Data Sheets (SDS)](http://web.chempliance.com/PublicAccess.aspx?t=5uGMHJCa1MleH2lkHnFu2g2)：document
- [Parker Chomerics Shelf Life Re-certification for EMI Shielding Paints, Sealants and Adhesives](https://hypher.com.cn/library-assets/1beb166d46b7f0cd6a3d48161d30da0fea317ac5c041939ae96b057d2adb5730.pdf)：document
- [Product Compliance: REACH SVHC Meets Requirements](https://hypher.com.cn/library-assets/11c283ca609c61dbe85aa917de9df63f3816a38f563e1926251e2d051b758bc0.pdf)：document
- [Recommended Surface Preparation for Epoxies, Acrylics and Silicones](https://hypher.com.cn/library-assets/2360693e66100e36470ad93c3bcb4a784b3a39d574eb6ae23b2e0b0dbfd40125.pdf)：document
- [Safety Data Sheet (SDS): CHO-BOND 584-29](http://qrcode.chempliance.com/OpenDoc.ashx?DocID=D68432DD-88B9-E711-BF8C-782BCB34946A)：document
- [Safety Data Sheet (SDS): CHO-BOND 584-29 CHO-PAK](http://qrcode.chempliance.com/OpenDoc.ashx?DocID=7CEF8A39-2137-E711-BF8B-782BCB34946A)：document
- [Safety Data Sheet (SDS): CHO-BOND 584-29 EPOXY HARDENER](http://qrcode.chempliance.com/OpenDoc.ashx?DocID=F66D8746-87B9-E711-BF8C-782BCB34946A)：document
- [Safety Data Sheet (SDS): CHO-BOND 584-29 SYRINGE-PAK](http://qrcode.chempliance.com/OpenDoc.ashx?DocID=0A476939-2137-E711-BF8B-782BCB34946A)：document
- [Selector Guide: Parker Chomerics Specialty Materials](https://hypher.com.cn/library-assets/5e5c947e792a0d02c27292e944050e145492c97c53479dde6edf4c49a8d6c485.pdf)：document
- [parker%20chomerics%20cho-bond%20584-29.pdf](http://www.parker.com/Literature/Chomerics/Parker%20Chomerics%20CHO-BOND%20584-29.pdf)：document

资料来源：[原始系列资料](https://ph.parker.com/cn/zh/product-list/cho-bond-584-29-two-component-easy-to-use-conductive-epoxy-adhesive)

价格、库存和交期请联系上海海费确认。更多型号和资料见 [完整系列页面](https://hypher.com.cn/products/sealing/cho-bond-584-29-two-component-easy-to-use-conductive-epoxy-adhesive)；[联系技术支持](https://hypher.com.cn/contact)