# CoolTherm® EP-6037/6252 Epoxy System

> CoolTherm® EP-6037/6252 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.

所属技术：密封技术

## 系列介绍

CoolTherm® EP-6037/6252 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. CoolTherm EP-6037/6010 epoxy system can also be used for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components. Features and Benefits: • Low Stress – exhibits low shrinkage and stress on components as it cures. • Excellent Adhesion – provides a strong adhesion bond to a wide variety of substrates. • Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during severe temperature cycling. Shelf Life/Storage: Shelf life for each component is one year when stored at 25°C in original, unopened container.

## 技术参数

| 参数 | 值 | 单位 |
| --- | --- | --- |
| 颜色 | Black or Green Paste (resin), Amber Liquid (hardener) |  |
| 动态粘度 | 500000 cP @ 25°C (resin), 75 cP @ 25°C (hardener) |  |
| 比重 | 2.35 (resin), 0.99 (hardener) |  |
| Cure Time | 24 Hours @ 25°C, 2 Hours @ 65°C |  |
| Hardness | 92 Shore D |  |
| 热导性 | 1.1 W/m-K |  |
| 搭接剪切强度 | 15 MPa, 2175 psi |  |
| 介电强度 | \> 15.7 kV/mm, \> 400 V/mil |  |

## 型号入口（首批）

- [CoolTherm EP-6037/6252](https://hypher.com.cn/products/model/cooltherm-ep-6037-6252-247b2d5cce9fd962/index.md)

资料来源：[原始系列资料](https://ph.parker.com/cn/zh/product-list/cooltherm-ep-6037-6252-epoxy-system)

价格、库存和交期请联系上海海费确认。更多型号和资料见 [完整系列页面](https://hypher.com.cn/products/sealing/cooltherm-ep-6037-6252-epoxy-system)；[联系技术支持](https://hypher.com.cn/contact)