# CoolTherm® ME-543 Underfill Encapsulant

> CoolTherm® ME-543 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for encapsulation of densely populated area array flip chip devices. Is formulated with the necessary structural strength to handle over-molding processes.

所属技术：密封技术

## 系列介绍

$19

## 技术参数

| 参数 | 值 | 单位 |
| --- | --- | --- |
| 颜色 | Black Liquid |  |
| 动态粘度 | 21000 cP @ 25°C |  |
| Number of Components | One-Component (1K) |  |
| Cure Time | 7 to 20 min @ 160 to 165°C |  |
| Working Time | 36 Hours @ 25°C |  |
| 热导性 | 1.2 W/m-K |  |

## 型号入口（首批）

- [CoolTherm ME-543](https://hypher.com.cn/products/model/cooltherm-me-543-b0193a83fe28807b/index.md)

## 技术资料与 CAD

- [CoolTherm Thermal Management Materials](https://www.parker.com/us/en/divisions/assembly-and-protection-solutions-division/solutions/cooltherm-thermal-management-materials.html)：document
- [Datasheet - CoolTherm ME-543 Underfill Encapsulant (English A4)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---CoolThermME-543%28EnglishA4%29_DS4024E.pdf)：document
- [Datasheet - CoolTherm ME-543 Underfill Encapsulant (English US)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---CoolThermME-543%28EnglishUS%29_DS4024.pdf)：document
- [Healthcare and Life Sciences Solutions - Medical Devices Manufacturing Products](https://corpapps.parker.com/interactive-media/industry/healthcare-life-sciences/medical-device-engineering-solutions)：document
- [Potting & Encapsulation Materials](https://www.parker.com/us/en/divisions/assembly-and-protection-solutions-division/solutions/cooltherm-thermal-management-materials/potting-and-encapsulation-materials.html)：document
- [Product Catalog - Microelectronic Materials](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials_PC3003.pdf)：document
- [Product Catalog - Microelectronic Materials Catalog (English A4) - India only](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials%28EnglishA4%29_India_PC3009E.pdf)：document
- [Product Catalog - Microelectronic Materials Catalog (Mexican Spanish)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials-Catalog%28MexicanSpanish%29_PC3003MS.pdf)：document
- [SDS-MSDS Safety Data Sheet: COOLTHERM ME-543](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Safety-Datasheets/SDS-MSDS-Safety-Data-Sheet---COOLTHERM-ME-543.pdf)：document
- [SDS-MSDS Safety Data Sheet: COOLTHERM ME-543 PLUS](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Safety-Datasheets/SDS-MSDS-Safety-Data-Sheet---COOLTHERM-ME-543-PLUS.pdf)：document
- [User Instructions - Electronic Materials Handling Instructions (-40°C Storage Temperature)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/User-Instructions/User-Instructions---Electronic-Materials-Handling%28-40C_StorageTemperature%29_UI3022.pdf)：document
- [What is CoolTherm?](https://www.parker.com/content/dam/videos/emg/assembly-and-protection-solutions-division/thermal-management/MM8296_CoolThermThermalManagement.mp4)：document

资料来源：[原始系列资料](https://ph.parker.com/cn/zh/product-list/cooltherm-me-543-underfill-encapsulant)

价格、库存和交期请联系上海海费确认。更多型号和资料见 [完整系列页面](https://hypher.com.cn/products/sealing/cooltherm-me-543-underfill-encapsulant)；[联系技术支持](https://hypher.com.cn/contact)