# Thermoset EP-937 Board Level Encapsulant

> Thermoset EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.

所属技术：密封技术

## 系列介绍

Thermoset EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards. Features and Benefits: • Convenient – requires no mixing; provides excellent shelf life stability; prepared under vacuum and contains no entrapped air or solvents. • Environmentally Resistant – provides excellent resistance to thermal shock and moisture. • Fast Cure – quickly cures at 150°C with a void-free, smooth surface. • Outstanding Adhesion – offers a fast elevated temperature cure for outstanding adhesion to a variety of materials. Shelf Life/Storage: Shelf life is six months when stored between 0° and 5°C in original, unopened container. Do not store containers outdoors or in nonventilated exterior structures. Store product away from heat sources such as ovens or hot plates. Elevated storage temperatures will shorten product’s shelf life.

## 技术参数

| 参数 | 值 | 单位 |
| --- | --- | --- |
| 动态粘度 | 47900 cP @ 77°F (25°C) |  |
| Hardness | 88 to 94 Shore D |  |
| Cure Time | 6 to 12 min @ 302°F (150°C), 18 to 28 min @ 248°F (120°C) |  |
| Working Time | 1 Months @ 77°F (25°C) |  |
| 颜色 | Black Paste |  |

## 型号入口（首批）

- [Thermoset EP-937](https://hypher.com.cn/products/model/thermoset-ep-937-6a0b0c973f761c9b/index.md)

## 技术资料与 CAD

- [Datasheet - Thermoset EP-937 Board Level Encapsulant](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---ThermosetEP-937_DS3619.pdf)：document
- [Potting & Encapsulation Materials](https://www.parker.com/us/en/divisions/assembly-and-protection-solutions-division/solutions/cooltherm-thermal-management-materials/potting-and-encapsulation-materials.html)：document
- [Product Catalog - Microelectronic Materials](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials_PC3003.pdf)：document
- [Product Catalog - Microelectronic Materials Catalog (English A4) - India only](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials%28EnglishA4%29_India_PC3009E.pdf)：document
- [Product Catalog - Microelectronic Materials Catalog (Mexican Spanish)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials-Catalog%28MexicanSpanish%29_PC3003MS.pdf)：document
- [Product Catalog - Potting & Encapsulation Materials Catalog](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Potting-and-Encapsulation-Materials_PC3002.pdf)：document
- [Product Catalog - Potting & Encapsulation Materials Catalog (English A4) - India only](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Potting-and-Encapsulation-Materials%28EnglishA4%29---India-only_PC3006E.pdf)：document
- [Product Catalog - Potting & Encapsulation Materials Catalog (Mexican Spanish)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Potting-and-Encapsulation-Materials%28MexicanSpanish%29_PC3002MS.pdf)：document
- [SDS-MSDS Safety Data Sheet: THERMOSET EP-937](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Safety-Datasheets/SDS-MSDS-Safety-Data-Sheet---THERMOSET-EP-937.pdf)：document
- [User Instructions - Electronic Materials Handling Instructions (0°C Storage Temperature)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/User-Instructions/User-Instructions---Electronic-Materials-Handling%280C_StorageTemperature%29_UI3047.pdf)：document
- [User Instructions - Electronic Materials Handling Instructions (5°C Storage Temperature)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/User-Instructions/User-Instructions---Electronic-Materials-Handling%28+5C_StorageTemperature%29_UI3023.pdf)：document
- [产品手册: 灌封材料](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Potting-and-Encapsulation-Materials%28Chinese%29_PC8003C.pdf)：document
- [技术说明书: Thermoset EP-937电路板级灌封胶](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---ThermosetEP-937%28Chinese%29_DS3619C.pdf)：document

资料来源：[原始系列资料](https://ph.parker.com/cn/zh/product-list/thermoset-ep-937-board-level-encapsulant)

价格、库存和交期请联系上海海费确认。更多型号和资料见 [完整系列页面](https://hypher.com.cn/products/sealing/thermoset-ep-937-board-level-encapsulant)；[联系技术支持](https://hypher.com.cn/contact)