# Thermoset EP-939 Board Level Encapsulant

> Thermoset EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.

所属技术：密封技术

## 系列介绍

Thermoset EP-939 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards. Features and Benefits • Convenient – requires no mixing; provides excellent shelf life stability; prepared under vacuum and contains no entrapped air or solvents. • Environmentally Resistant – provides excellent resistance to thermal shock and moisture. • Fast Cure – quickly cures at 150°C with a void-free, smooth surface. • Outstanding Adhesion – offers a fast elevated temperature cure for outstanding adhesion to a variety of materials. Shelf Life/Storage Shelf life is six months when stored between 0° and 5°C in original, unopened container. Do not store containers outdoors or in non-ventilated exterior structures. Store product away from heat sources such as ovens or hot plates. Elevated storage temperatures will shorten product’s shelf life.

## 技术参数

| 参数 | 值 | 单位 |
| --- | --- | --- |
| 动态粘度 | 37200 cP @ 77°F (25°C) |  |
| Hardness | 87 to 95 Shore D |  |
| Cure Time | 20 min @ 302°F (150°C) |  |
| Working Time | 1 Months @ 77°F (25°C) |  |
| 颜色 | Black Paste |  |

## 型号入口（首批）

- [Thermoset EP-939](https://hypher.com.cn/products/model/thermoset-ep-939-35396cb9a1241860/index.md)

## 技术资料与 CAD

- [Datasheet - Thermoset EP-939 Board Level Encapsulant](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---ThermosetEP-939_DS3620.pdf)：document
- [Potting & Encapsulation Materials](https://www.parker.com/us/en/divisions/assembly-and-protection-solutions-division/solutions/cooltherm-thermal-management-materials/potting-and-encapsulation-materials.html)：document
- [User Instructions - Electronic Materials Handling Instructions (5°C Storage Temperature)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/User-Instructions/User-Instructions---Electronic-Materials-Handling%28+5C_StorageTemperature%29_UI3023.pdf)：document

资料来源：[原始系列资料](https://ph.parker.com/cn/zh/product-list/thermoset-ep-939-board-level-encapsulant)

价格、库存和交期请联系上海海费确认。更多型号和资料见 [完整系列页面](https://hypher.com.cn/products/sealing/thermoset-ep-939-board-level-encapsulant)；[联系技术支持](https://hypher.com.cn/contact)