# Thermoset ME-588 Underfill Encapsulant

> Thermoset ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.

所属技术：密封技术

## 系列介绍

$18

## 技术参数

| 参数 | 值 | 单位 |
| --- | --- | --- |
| 动态粘度 | 13000 cP @ 77°F (25°C) |  |
| Cure Time | 7 to 20 min @ 320 to 329°F (160 to 165°C) |  |
| Working Time | 36 Hours @ 77°F (25°C) |  |
| 颜色 | Black Liquid |  |

## 型号入口（首批）

- [Thermoset ME-588](https://hypher.com.cn/products/model/thermoset-me-588-51fbd88f332e9a29/index.md)

## 技术资料与 CAD

- [Datasheet - Thermoset ME-588 Underfill Encapsulant (English A4)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---ThermosetME-588%28EnglishA4%29_DS4124E.pdf)：document
- [Datasheet - Thermoset ME-588 Underfill Encapsulant (English US)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---ThermosetME-588%28EnglishUS%29_DS4124.pdf)：document
- [Potting & Encapsulation Materials](https://www.parker.com/us/en/divisions/assembly-and-protection-solutions-division/solutions/cooltherm-thermal-management-materials/potting-and-encapsulation-materials.html)：document
- [Product Catalog - Microelectronic Materials](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials_PC3003.pdf)：document
- [Product Catalog - Microelectronic Materials Catalog (English A4) - India only](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials%28EnglishA4%29_India_PC3009E.pdf)：document
- [Product Catalog - Microelectronic Materials Catalog (Mexican Spanish)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Product-Catalogs/Product-Catalog---Microelectronic-Materials-Catalog%28MexicanSpanish%29_PC3003MS.pdf)：document
- [SDS-MSDS Safety Data Sheet: THERMOSET ME-588](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Safety-Datasheets/SDS-MSDS-Safety-Data-Sheet---THERMOSET-ME-588.pdf)：document
- [User Instructions - Electronic Materials Handling Instructions (-40°C Storage Temperature)](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/User-Instructions/User-Instructions---Electronic-Materials-Handling%28-40C_StorageTemperature%29_UI3022.pdf)：document
- [技术说明书: Thermoset ME-588 底部填充胶](https://www.parker.com/content/dam/Parker-com/Literature/Assembly---Protection-Solutions-Division/Technical-Datasheets-%28TDS%29/Datasheet---ThermosetME-588%28Chinese%29_DS4124C.pdf)：document

资料来源：[原始系列资料](https://ph.parker.com/cn/zh/product-list/thermoset-me-588-underfill-encapsulant)

价格、库存和交期请联系上海海费确认。更多型号和资料见 [完整系列页面](https://hypher.com.cn/products/sealing/thermoset-me-588-underfill-encapsulant)；[联系技术支持](https://hypher.com.cn/contact)