产品技术
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
技术概览
通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。
产品系列
LORD® 5801S/61 acrylic adhesive system is specifically formulated to provide high strength in a room-temperature curing adhesive. LORD Accelerator 61 contains a photo initiator, allowing use of UV or visible light to remove surface tack.
LORD AC-902 LC adhesive is a one-component, light-curing (LC) acrylic resin used to coat, reinforce, seal or adhere to various materials. LORD AC-902 LC adhesive can be cured in seconds utilizing visible or UV light.
This product is no longer available - please contact us for further assistance.
Note: This product is no longer available - please contact us for further assistance.
Thermoset 7195-125 Black adhesive is a one-component epoxy adhesive designed for use in SMD component mounting where non-stringing is necessary.
Thermoset 741 A/B adhesive is a medium viscosity structural adhesive that cures to a tough, high impact polymer and provides exceptional adhesion to a wide variety of substrates. It features rapid cure in thin films and convenient mix ratio by volume.
Thermoset 945-6443 adhesive is an amber-colored, one-component epoxy designed for a variety of electronics applications.
Thermoset DC-80 adhesive is a two-component epoxy adhesive system used in varying mix ratios to provide optimum properties.
Thermoset® MD-130 adhesive is a one-component, micro-electronic adhesive designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.
Circalok 6027 adhesive is a one-component, thixotropic epoxy adhesive designed for use in SMD component mounting.
Circalok 6756 primer is designed for use in electronics applications to bond Room Temperature Vulcanized (RTV) silicone rubbers to most metals and glass. It may also be used to bond addition-cure RTV silicones.
LORD® 2232 solvent is used to reduce viscosity of LORD 2232 silver conductive coating for dip applications. LORD 2232 solvent is specifically designed for use with LORD 2232 silver conductive coating only.
典型应用
从元件选型到系统集成，围绕压力、温度、介质、环境和生命周期目标优化方案。
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