产品技术

密封技术

通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。

技术概览

适用于严苛环境的工程材料

通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。

产品系列

覆盖关键系统环节

Thermoset 300/18 Epoxy System

Thermoset 300/18 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/65 Epoxy System

Thermoset 300/65 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/67 Epoxy System

Thermoset 300/67 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/70 Epoxy System

Thermoset 300/70 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/72 Epoxy System

Thermoset 300/72 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 311 Epoxy Encapsulant

Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures and applications where high thermal shock is expected. It provides a semi-rigid epoxy system.