产品技术

密封技术

通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。

技术概览

适用于严苛环境的工程材料

通过材料科学、型面设计和应用工程，为温度、压力、介质与摩擦挑战提供可靠密封。

产品系列

覆盖关键系统环节

导热凝胶

派克固美丽 THERM-A-GAP GEL 30G 全固化可散布凝胶作为一个单一成份全固化系统有着3.5w/m-k导热能力。

THERM-A-GAP GEL 20 导热凝胶

Parker Chomerics THERM-A-GAP™ GEL 20 is a dispensable gel that has 2.4 W/m-K Thermal Conductivity as a one component fully cured system.

THERM-A-GAP CIP 35E Thermally Conductive Cure-In-Place Compound

Parker Chomerics THERM-A-GAP® CIP 35E is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity.

导热凝胶

派克固美丽 THERM-A-GAP GEL 8010 全固型可布撒凝胶有着 3.0W/m-K 的导热性能，作为单一成份全固型系统还有着薄的粘接层。

导热凝胶

THERM-A-GAP T630 GEL 是一种高柔顺，预固化，单一成份化合物有着 0.7W/m-K 的导热性能。

导热凝胶

THERM-A-GAP T6356 凝胶是一种高柔顺型，预固型，有着 2.4W/m-K 导热性能的单一成份化合物

CoolTherm® MG-121 Thermally Conducive Gel

CoolTherm® MG-121 thermally conductive gel is a one-component, silicone interface material that exhibits very low thermal resistance properties compared to other thermal interface materials. It is formulated to provide good HAST resistance.

CoolTherm® MG-133 Thermally Conductive Gel

This product is no longer available, please contact us for further assistance.

THERM-A-GAP PAD 30 导热垫片

Parker Chomerics THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads provide a soft (30 Shore 00) solution with 3.2 W/m-K of thermal conductivity.

THERM-A-GAP PAD 70TP 导热垫片

Parker Chomerics THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads provide a very low hardness (15 Shore 00) solution with 7.0 W/m-K of thermal conductivity.