
THERM-A-GAP GEL 40NS 非硅导热凝胶
Parker Chomerics THERM-A-GAP™ GEL 40NS is a single-component, non-silicone, fully cured, dispensable gel with 4.0 W/m-K thermal conductivity.
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Parker Chomerics THERM-A-GAP™ GEL 40NS is a single-component, non-silicone, fully cured, dispensable gel with 4.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 37 is a single-component, fully cured, dispensable thermal gel with 3.7 W/m-K Thermal Conductivity, designed for more consistent and repeatable dispensing by minimizing batch-to-batch flow rate variations.

派克固美丽 THERM-A-GAP GEL 30G 全固化可散布凝胶作为一个单一成份全固化系统有着3.5w/m-k导热能力。

Parker Chomerics THERM-A-GAP™ GEL 20 is a dispensable gel that has 2.4 W/m-K Thermal Conductivity as a one component fully cured system.

Parker Chomerics THERM-A-GAP® CIP 35E is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity.

派克固美丽 THERM-A-GAP GEL 8010 全固型可布撒凝胶有着 3.0W/m-K 的导热性能,作为单一成份全固型系统还有着薄的粘接层。

THERM-A-GAP T630 GEL 是一种高柔顺,预固化,单一成份化合物有着 0.7W/m-K 的导热性能。


CoolTherm® MG-121 thermally conductive gel is a one-component, silicone interface material that exhibits very low thermal resistance properties compared to other thermal interface materials. It is formulated to provide good HAST resistance.

This product is no longer available, please contact us for further assistance.

Parker Chomerics THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads provide a soft (30 Shore 00) solution with 3.2 W/m-K of thermal conductivity.

Parker Chomerics THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads provide a very low hardness (15 Shore 00) solution with 7.0 W/m-K of thermal conductivity.
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