PRODUCT CENTER
从产品分类逐步缩小范围，查找适合您应用的产品系列与技术资料。
PRODUCT CATEGORIES
按连接形式浏览流体连接产品。
浏览子分类 →浏览流体输送管路及软管总成。
浏览子分类 →
按驱动方式浏览直线与旋转执行元件。
浏览子分类 →
浏览液压马达、电机、驱动器及运动控制。
浏览子分类 →
按控制功能和应用浏览阀产品。
浏览子分类 →按工作原理浏览液压泵及相关产品。
浏览子分类 →
浏览储能、调压及精密流体控制产品。
浏览子分类 →
按工作介质和过滤用途选择产品。
浏览子分类 →
按密封形式浏览密封件及工程材料。
浏览子分类 →浏览冷却、导热及电磁屏蔽产品。
浏览子分类 →
浏览飞行控制、燃油、液压及制动系统。
浏览子分类 →浏览真空发生、吸附和搬运产品。
浏览产品系列 →PRODUCT SERIES
查看系列能力、可选型号和技术资料。
Thermoset ES-40/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset® Hardener No. 18 is a general purpose curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and cured properties.
Thermoset Hardener No. 25 is a curing agent designed for use with select LORD and Thermoset epoxy resins to obtain a variety of handling and cured properties. Compositions using this hardener are moisture insensitive and cure to a high gloss.
Thermoset Hardener No. 37 is a curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Provides improved flexibility and impact strength for use in room temp curing adhesive application.
Thermoset Hardener No. 65 is a curing agent used with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for all types of room temp curing applications including adhesives & 100% solids coatings.
Thermoset Hardener No. 66 is a general purpose curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for variety of applications including structural adhesives and laminates.
Thermoset® Hardener No. 67 is a curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and curing properties. Suitable for many types of encapsulation and potting applications.
Thermoset Hardener No. 70 is a curing agent designed for use with select LORD, CoolTherm & Thermoset epoxy resins to obtain variety of handling & curing properties. Compositions using this hardener have comparatively low viscosity & low surface tension.
Thermoset® Hardener No. 71 is a curing agent used with select LORD & Thermoset epoxy resins to provide semi-rigid epoxy system for use in applications where thermal shock is expected. Suitable for applications requiring thick section casting.
Thermoset No. 72 Hardener is used with Thermoset 300 resin to provide a semi-rigid epoxy system which cures at room temperature. It exhibits low exothermic heat rise during room temperature cure, and has excellent thermal and mechanical shock resistance.
Thermoset LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical lamination and potting applications. It can also be used as a reworkable underfill encapsulant.
Thermoset ME-430 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of COB devices. Offers good adhesion to laminate & ceramic substrates. Can be used in high-end, consumer printed circuit board and semiconductor applications.
从工况出发，找到合适的产品