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Thermoset ME-455 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. Offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces.
Thermoset ME-456 encapsulant is a one-component, semiconductor grade epoxy dam material for use in the encapsulation of wire-bonded or flip chip devices where a dam is needed to restrict flow of a cavity fill encapsulant.
Thermoset ME-588 BK encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
Thermoset ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
This product is no longer available - please contact us for further assistance.
Thermoset SC-400 silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel consistency using either room temp or heat cure. It contains a UV dye to aid inspection.
This product is no longer available - please contact us for further assistance.
Thermoset UR-325 encapsulant is a two-component urethane system designed for encapsulating delicate, pressure or shock sensitive electronic components. It cures to a low modulus material using room temperature cure.
Thermoset® SC-300M silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel-like consistency using either room temperature or heat cure.
Thermoset® UR-312 urethane encapsulant is a two-component, low modulus system designed for encapsulation of fragile, pressure-sensitive microelectronic components. It is formulated for use at different mix ratios to obtain different cured properties.
近日，上海海费控制设备有限公司苏州分公司成立并完成乔迁，苏州客服中心同步正式投入运营，全面升级为客户服务的能力。
2019年4月，上海海费控制设备有限公司携Parker派克防爆电磁阀参加第二届中国（东营）国际石油化工贸易展览会，与炼油及石油化工领域客户围绕防爆电磁阀选型、应用及流体控制需求开展现场交流。
2019年6月，上海海费控制设备有限公司携Parker派克电磁阀及仪表管阀件参加第八届上海国际泵管阀展览会，与工业客户围绕流体控制产品选型、应用及工况适配开展现场交流。
2018年5月31日至6月2日，上海海费控制设备有限公司携Parker派克流体控制产品参加第七届FLOWTECH CHINA上海国际泵管阀展，与工业客户围绕产品选型、应用及实际工况开展交流。
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接头和快换接头 / 扩口接头
接头和快换接头 / 扩口接头 / 37°扩口接头
接头和快换接头 / 扩口接头 / 45°扩口接头
接头和快换接头 / 扩口接头 / 90°扩口接头
液压缸、气缸、电动缸、执行器 / 蓄能器
液压缸、气缸、电动缸、执行器 / 蓄能器 / Accumulator Services
航空系统与技术 / Aerospace Motor Drives, Controllers, and Software