密封技术
查看系列 →导热凝胶
派克固美丽THERM-A-GAP GEL 30 全固化可散布凝胶作为一个单一成份全固化系统有着3.5w/m-k导热能力。
搜索
站内搜索
输入订货号、型号或关键词，搜索产品、技术资料与新闻文章。
产品系列（6625）
密封技术
查看系列 →THERM-A-GAP GEL 25NS 非硅导热凝胶
Parker Chomerics THERM-A-GAP™ GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity.
密封技术
查看系列 →THERM-A-GAP CIP 60 Thermally Conductive Cure-In-Place Compound
Parker Chomerics THERM-A-GAP CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity.
密封技术
查看系列 →THERM-A-FORM CIP35 双组份导热凝胶
Parker Chomerics THERM-A-GAP® CIP 35 is two component dispensable thermal compound with 2.5 W/m-K thermal conductivity.
密封技术
查看系列 →THERM-A-GAP TC50 高性能导热凝胶
Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity
密封技术
查看系列 →导热凝胶
THERM-A-GAP T635 凝胶是一种高柔顺型, 预固型, 有着 1.7W/m-K 导热性能的单一成份化合物
密封技术
查看系列 →CoolTherm® MG-120 导热凝胶
CoolTherm® MG-120 导热凝胶是一种单组分有机硅界面材料，具有润滑脂的低热阻特性，同时具有凝胶的完整性。
密封技术
查看系列 →CoolTherm® MG-122 Thermally Conductive Gel
CoolTherm® MG-122 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel. It is specifically developed for excellent HAST resistance.
密封技术
查看系列 →THERM-A-GAP PAD 10 Thermally Conductive Gap Filler Pads
Parker Chomerics THERM-A-GAP® PAD 10 is a high performance, low hardness thermal gap filler pad with a typical thermal conductivity of 1.0 W/m-K.
密封技术
查看系列 →THERM-A-GAP PAD 60 导热垫片
Parker Chomerics THERM-A-GAP™ PAD 60 Thermally Conductive Gap Filler Pads provide a low hardness (40 Shore 00) solution with 6.0 W/m-K of thermal conductivity.
密封技术
查看系列 →THERM-A-GAP PAD 80 导热垫片
Parker Chomerics THERM-A-GAP™ PAD 80 Thermally Conductive Gap Filler Pads provide a low hardness (35 Shore 00) solution with 8.3 W/m-K of thermal conductivity.
密封技术
查看系列 →THERM-A-GAP PAD 80LOE Thermally Conductive Gap Filler Pads
Parker Chomerics THERM-A-GAP™ PAD 80LOE is a high performance, low oil bleed, thermal gap filler pad with a typical thermal conductivity of 8.0 W/m-K.