流体连接
查看系列 →Parkrimp非剥胶扣压接头 - 73系列
派克73系列是Parkrimp永久扣压式液压接头，可使用Parkrimp系列扣压机进行快速组装。
搜索
站内搜索
输入订货号、型号或关键词，搜索产品、技术资料与新闻文章。
产品系列（6625）
流体连接
查看系列 →SMCP系列镀镍黄铜扣压式套筒
SMCP系列扣压式镀镍黄铜套筒，作为软管接头的一个组件，用于加工派克柴油发动机排放流体（DEF）软管总成
密封技术
查看系列 →Thermoset EP-20/18 Epoxy System
Thermoset EP-20/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-20/25 Epoxy System
Thermoset EP-20/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-20/37 Epoxy System
Thermoset EP-20/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-20/65 Epoxy System
Thermoset EP-20/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-20/66 Epoxy System
Thermoset EP-20/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-20/67 Epoxy System
Thermoset EP-20/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-20/70 Epoxy System
Thermoset EP-20/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-20/71 Epoxy System
Thermoset EP-20/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
密封技术
查看系列 →Thermoset EP-729 Board Level Encapsulant
Thermoset EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.
密封技术
查看系列 →Thermoset EP-937 Board Level Encapsulant
Thermoset EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.