密封技术
查看系列 →Thermoset ES-40/71 Epoxy System
Thermoset ES-40/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
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产品系列（6625）
密封技术
查看系列 →Thermoset Hardener No. 18
Thermoset® Hardener No. 18 is a general purpose curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and cured properties.
密封技术
查看系列 →Thermoset Hardener No. 25
Thermoset Hardener No. 25 is a curing agent designed for use with select LORD and Thermoset epoxy resins to obtain a variety of handling and cured properties. Compositions using this hardener are moisture insensitive and cure to a high gloss.
密封技术
查看系列 →Thermoset Hardener No. 37
Thermoset Hardener No. 37 is a curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Provides improved flexibility and impact strength for use in room temp curing adhesive application.
密封技术
查看系列 →Thermoset Hardener No. 65
Thermoset Hardener No. 65 is a curing agent used with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for all types of room temp curing applications including adhesives & 100% solids coatings.
密封技术
查看系列 →Thermoset Hardener No. 66
Thermoset Hardener No. 66 is a general purpose curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for variety of applications including structural adhesives and laminates.
密封技术
查看系列 →Thermoset Hardener No. 67
Thermoset® Hardener No. 67 is a curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and curing properties. Suitable for many types of encapsulation and potting applications.
密封技术
查看系列 →Thermoset Hardener No. 70
Thermoset Hardener No. 70 is a curing agent designed for use with select LORD, CoolTherm & Thermoset epoxy resins to obtain variety of handling & curing properties. Compositions using this hardener have comparatively low viscosity & low surface tension.
密封技术
查看系列 →Thermoset Hardener No. 71
Thermoset® Hardener No. 71 is a curing agent used with select LORD & Thermoset epoxy resins to provide semi-rigid epoxy system for use in applications where thermal shock is expected. Suitable for applications requiring thick section casting.
密封技术
查看系列 →Thermoset Hardener No. 72
Thermoset No. 72 Hardener is used with Thermoset 300 resin to provide a semi-rigid epoxy system which cures at room temperature. It exhibits low exothermic heat rise during room temperature cure, and has excellent thermal and mechanical shock resistance.
密封技术
查看系列 →Thermoset LS 213-9 Epoxy Encapsulant
Thermoset LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical lamination and potting applications. It can also be used as a reworkable underfill encapsulant.
密封技术
查看系列 →Thermoset ME-430 Board Level Encapsulant
Thermoset ME-430 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of COB devices. Offers good adhesion to laminate & ceramic substrates. Can be used in high-end, consumer printed circuit board and semiconductor applications.