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Thermoset ME-455 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. Offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces.
Thermoset ME-456 encapsulant is a one-component, semiconductor grade epoxy dam material for use in the encapsulation of wire-bonded or flip chip devices where a dam is needed to restrict flow of a cavity fill encapsulant.
Thermoset ME-588 BK encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
Thermoset ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
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Thermoset SC-400 silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel consistency using either room temp or heat cure. It contains a UV dye to aid inspection.
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Thermoset UR-325 encapsulant is a two-component urethane system designed for encapsulating delicate, pressure or shock sensitive electronic components. It cures to a low modulus material using room temperature cure.
Thermoset® SC-300M silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel-like consistency using either room temperature or heat cure.
Thermoset® UR-312 urethane encapsulant is a two-component, low modulus system designed for encapsulation of fragile, pressure-sensitive microelectronic components. It is formulated for use at different mix ratios to obtain different cured properties.