CoolTherm® EP-3500/EP-2000 two-component epoxy system is for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.
颜色：Dark Gray Paste (resin), White Liquid (hardener), Gray Paste (mixed) 动态粘度：9200 cP @ 60°C (resin), 1300 cP @ 60°C (hardener), 3800 cP @ 60°C (mixed) Number of Components：Two-Component (2K)
CoolTherm® EP-6008 BLK/6010 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
颜色：Black Liquid (resin), Amber Liquid (hardener) 动态粘度：8000 cP @ 25°C (resin), 55 cP @ 25°C (hardener) Number of Components：Two-Component (2K)
CoolTherm® EP-6008 BLK/6252 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
颜色：Black Liquid (resin), Amber Liquid (hardener) 动态粘度：8000 cP @ 25°C (resin), 75 cP @ 25°C (hardener) Number of Components：Two-Component (2K)
CoolTherm® EP-6008 BLK/Thermoset No.67 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
颜色：Black Liquid (resin), Amber Liquid (hardener) 动态粘度：8000 cP @ 25°C (resin), 30 cP @ 25°C (hardener) Number of Components：Two-Component (2K)
CoolTherm® EP-6009 encapsulant is a two-component epoxy system designed to provide thermal conductivity for potting applications requiring flame retardance.
颜色：Black Liquid (resin), Amber Liquid (hardener), Black Liquid (mixed) 动态粘度：17500 cP @ 25°C (resin), 40 cP @ 25°C (hardener), 2600 cP @ 25°C (mixed) Number of Components：Two-Component (2K)
CoolTherm® EP-6010 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
颜色：Amber Liquid 动态粘度：55 cP @ 25°C Number of Components：One-Component (1K)
CoolTherm® EP-6028/6029 encapsulant is a two-component epoxy system used for potting high voltage transformers, specifically units designed for high temp service. It provides a rigid epoxy system for use in applications where thermal shock is expected.
颜色：Blue Liquid (resin), Pink Liquid (hardener), Blue Liquid (mixed) 动态粘度：34000 cP @ 25°C (resin), 1800 cP @ 25°C (hardener), 15000 cP @ 25°C (mixed) Number of Components：Two-Component (2K)
CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.
Number of Components：Two-Component (2K) 颜色：Black Liquid (resin), Tan Liquid (hardener), Black Liquid (mixed) 动态粘度：9500 cP @ 25°C (resin), 14000 cP @ 25°C (hardener), 12000 cP @ 25°C (mixed)
CoolTherm® EP-6252 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD® epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
颜色：Amber Liquid 动态粘度：75 cP @ 25°C Number of Components：One-Component (1K)
CoolTherm® EP-636 epoxy encapsulant is a two-component system specifically designed for high temperature applications. It is recommended for encapsulation of electric motor stator assemblies used on downhole oil pumps.
颜色：White Liquid (resin), Black Liquid (hardener), Gray Liquid (mixed) 动态粘度：86000 cP @ 25°C (resin), 3500 cP @ 25°C (hardener), 50000 cP @ 25°C (mixed) Number of Components：Two-Component (2K)
CoolTherm® ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
颜色：Black Liquid 动态粘度：6000 cP @ 25°C Number of Components：One-Component (1K)
CoolTherm® ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
颜色：Black Liquid 动态粘度：4000 cP @ 25°C Number of Components：One-Component (1K)
