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CoolTherm® ME-543 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for encapsulation of densely populated area array flip chip devices. Is formulated with the necessary structural strength to handle over-molding processes.
CoolTherm® ME-555 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® SC-104 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-252 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-303 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/ electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-305 silicone encapsulant is a two-component system used for a variety of electronics applications where high heat dissipation is required.
CoolTherm® SC-309 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-320 SLW silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-320 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-324 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-324 XLW silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-6702 thermally conductive silicone encapsulant is a two-component system designed to provide thermal conductivity forencapsulating sensitive electronic modules.