CoolTherm® EP-6037/6010 Epoxy System

CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. CoolTherm EP-6037/6010 epoxy system can also be used for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components. Features and Benefits: • Low Stress – exhibits low shrinkage and stress on components as it cures. • Excellent Adhesion – provides a strong adhesion bond to a wide variety of substrates. • Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during severe temperature cycling. Shelf Life/Storage: Shelf life for each component is one year when stored at 25°C in original, unopened container.