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CoolTherm® MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.
CoolTherm® MD-140 SP (Small Particle) silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.
CoolTherm® EP-6007 BLK/6252 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.
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CoolTherm® SC-3500 导热、低挥发性有机硅填隙剂是一种双组分系统，旨在为电子应用提供出色的导热性，同时保留与有机硅相关的理想性能。
CoolTherm® SC-6754 润滑脂是一种单组分有机硅材料，用于通过置换配合表面之间的气隙在半导体和散热器之间提供热路径。它还用作非固化、抗冲击密封剂。
CoolTherm® TC-404 thermally conductive grease is a non-reactive, solvent-free silicone material designed for applications where a highly conductive thermal interface material is required and where the device may later need to be easily removed.
CoolTherm® TC-501 grease is a solvent-free silicone thermal interface material designed to replace greases used as TIMs between the heat spreader and the heat sink (commonly known as TIM2).
CoolTherm® UR-2000 gap filler is a two-component thermally conductive urethane system designed to provide thermal conductivity for electronic applications. It cures at room temperature to produce a flame-retardant adhesive.
CoolTherm® SC-1600 thermally conductive silicone gap filler is a two-component system designed to provide thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-3000 LD (Low Density) gap filler is a low density, two-component silicone system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-2000 SLW (slow) thermally conductive, soft-curing gap filler is a two-component system which provides excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.